| PART |
Description |
Maker |
| 28F1602C3 28F3204C3 29066605 |
3 Volt Advanced Stacked Chip Scale Package Memory
From old datasheet system
|
Intel
|
| RD38F1010C0ZTL0 RD38F1020C0ZTL0 RD28F1602C3T110 RD |
3 VOLT INTEL Advanced Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye
|
INTEL[Intel Corporation]
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| M38503M14H-700FP M38503M4-254FP M38503M2-403FP M38 |
NO-NIK KIT SCA-NN175-KIT
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
|
Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
|
| MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc.
Spansion, Inc.
|
| RD28F1602C3B110 RD28F1602C3BD70 RD28F1604C3BD70 RD |
CAPACITOR, BESTCAP 33 MILLI FARAD 7V CAPACITOR, BESTCAP 33 MILLI FARAD 7V; CAPACITANCE:33MF; VOLTAGE RATING, DC:7V; CAPACITOR DIELECTRIC TYPE:ELECTRONIC; SERIES:BESTCAP; TEMP, OP. MAX:75(DEGREE C); TEMP, OP. MIN:-20(DEGREE C); RoHS Compliant: Yes
3 VOLT INTEL Advanced Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye SPECIALTY MEMORY CIRCUIT, PBGA66
|
Intel Corp.
Intel, Corp.
Intel Corporation
|
| S71GL512NB0 S71GL128NB0 S71GL256NB0 |
Stacked Multi-chip Product (MCP)
|
SPANSION[SPANSION]
|
| S71WS128J |
Stacked Multi-Chip Product (MCP)
|
SPANSION
|
| S75WS256NDFBFWMA S75WS256NDFBFWMB S75WS256NDFBAWMA |
Stacked Multi-Chip Product (MCP)
|
SPANSION[SPANSION]
|
| ECWU2272V16 |
Stacked Metallized PEN Film Chip Capacitor
|
Panasonic Semiconductor
|
| LRS1337 |
Stacked Chip 32M Flash Memory and 4M SRAM
|
SHARP[Sharp Electrionic Components]
|
